Satapathy, … et al. Nof, Jose Ceroni, … et al. A Concise Guide - John C. Psycharis, … et al. Wong, … et al. White, Jon Martin, J. Discussion The results presented here establish concepts, as well as routes for practical implementation, for 3D microstructure designs in soft electronics.
Methods Finite element analysis Three-dimensional FEA techniques allowed prediction of the mechanical deformations and stress distributions of helical interconnects and entire circuit systems, during processes of compressive buckling and re-stretching. Fabrication process for soft wireless electronics Processes similar to those described in the previous section, but with additional steps in spin-casting, metal deposition, photolithography and reactive ion etching yielded networks with electrically isolated crossing points and contact pads as interfaces to electronic components.
Circuit design for three-axis acceleration sensing module A digital accelerometer ADXL, Analog Devices enabled measurements along three orthogonal axes. Circuit design for wireless powering module Resonant inductive coupling using an unshielded wire wound inductor coil 27TC, Murata Power Solutions Inc.
Data availability The data that support the findings of this study are available from the corresponding authors on reasonable request. Additional information How to cite this article: Supplementary Material Supplementary Information: Click here to view. Footnotes The authors declare no competing financial interests. Materials and mechanics for stretchable electronics. Science , Emerging technologies for next-generation point-of-care testing.
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